Facility & Equipment

  • Facility

    • Manufacturing: 35,000 sq. ft.

    • Office space: 3,000 sq. ft.

  • Frontline - Insight

    • Expedite Design analysis and quoting

  • Maskless Direct Imaging

    • Direct Imaging Technology since 2013

    • Use for all circuit imaging and available for soldermask

    • Resolution down to 2 MIL trace and space

  • PAL Automated Pulse Plating

    • Installed in 2022

    • Pulse plating for aspect ratio up to 20:1

    • Heavy copper plating available

    • In-line Microvia Fill (Coming soon in 2023!)

    • Automated dosing for steady state process control

    • Semi-automated daily analysis using Metrohm Professional CVS 894

  • Pluritec Inspecta HPL S2 Plus X-Ray Drill and Router with Vision

    • Optimize drill position after lamination for multilayer boards

    • Control Depth Drill and Rout

    • Layer analysis for improved stack-up yields

  • Mass VHF 200 and Wise Cleverstar

    • Conductive or non-conductive Via fill in accordance with IPC 6012 Class 3

    • Controlled planarization to minimize surface variation after paste removal

  • IPS Strip - Etch - Strip

    • 2 MIL Trace and Space

    • 3 MIL Cores Handling

    • Automated dosing for steady state process control

  • IPS Deep Gold Line

    • Allows processing of selective hard gold on full production panel, not just gold fingers

  • Pluritec Ecospray

    • Spray solder mask application with conveyorized tack-dry

    • Flexible colours: Green, Blue, Black, Red, White, Purple, Orange, Transparent

    • Easily coat any thickness of board

  • Microcraft JetPrint Direct Legend Printer

    • Digital ident printing (white)

  • TC-120 Automated Oven

    • Conveyorized Oven for consistent curing of solder mask

  • IPS Electroless Nickel Immersion Gold (ENIG)

    • Semi-automated ENIG plating