CERTIFICATION

• ISO 9001-2008
• UL approved File E64339
• CGP (Military) pending

ELECTRICAL TESTING

• Grid Test (dedicated fixture) or Moving Probe (fixtureless)
• Up to 250V electrical test

LAYERS

• 1 to 16

SPECIAL TECHNOLOGIES

• Controlled Impedance

MATERIALS

• FR-4 (1/2oz – 6 oz Cu)
• FR-4 170Tg (RoHS/Multi-layer)
• FR-4 140Tg (Double sided)
• Polyimide
• Teflon
• Arlon
• Rogers
• Thermal Clad® Insulated Metal Substrate
• Others (please inquire)

Note:

1. All boards manufactured to IPC Class 2 unless otherwise specified.
2. Use "STANDARD" values or greater if design density permits to avoid cost penalties.
3. Designs which do not meet minimum requirements must be reviewed by our manufacturing engineers.

DRILLING BOARD PROFILING

• Blind buried via
• Controlled depth drilling
• Countersinking
• Routing
• V-Groove scoring
• Milling
• Beveling

SOLDER MASK / VIA PLUGGING

• Liquid Photo-imagable (LPI)
• Green, matte green, blue, black, Red, white, clear, other
• Peelable Mask
• Via plugging

IDENT / SILKSCREEN

• White, yellow, black, red, other
• LPI or Thermal

DATA FILE FORMAT

Gerber Data - RS274X (Extended Gerber – preferred); ODB++; RS274D
Drill Data – Excellon, ASCII

We are capable of converting or regenerating data (design dependant) from:

• AutoCAD (DWG, DXF)
• Acrobat (PDF)
• Picture (JPG, TIFF, other)
• Transparency Film artwork
• and more

BOARD FINISHES

• Hot Air Solder Level (HASL)
• Immersion Gold on Electroless Ni
• Electrolytic Gold (Hard Gold)
• Gold Edge Fingers (board edge)
• Selective Hard Gold (not on edge)
• Immersion Silver
• Carbon Paste
• Immersion (White) Tin
• Board Edge Plating

DESIGN VERIFICATION

Each design is routinely checked to identify many design issues such as:

• Broken connections
• Un-terminated traces
• Missing solder mask clearances
• Missing pads or holes on through hole pad-stacks
• and more

…however, we cannot be held liable for failing to identify design issues.