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CERTIFICATION
  • ISO 9001-2008
  • AS9100 Aerospace
  • UL approved File E64339
  • CGP (Military) pending
ELECTRICAL TESTING
  • Grid Test (dedicated fixture) or Moving Probe (fixtureless)
  • Up to 250V electrical test
LAYERS
  • 1 to 16
SPECIAL TECHNOLOGIES
  • Controlled Impedance
MATERIALS
  • FR-4 180 Tg (RoHS/Multi-layer)
  • FR-4 (1/2oz – 6 oz Cu)
  • FR-4 170Tg (RoHS/Multi-layer)
  • FR-4 140Tg (Double sided)
  • Polyimide
  • Teflon
  • Arlon
  • Rogers
  • Thermal Clad® Insulated Metal Substrate
  • Ventec Insulated Metal Substrate
  • Thermagon M/L - Insulated Metal Substrate
  • Others (please inquire)
MINIMUM DESIGN LIMITS (mil)
More Expensive
Standard
Cheaper
Finished Hole Size
6 10 13
Annular Ring

IPC Class 2

5

6

7.5

 

IPC Class 3

7

8

9

Via copper pad (hole + ann. ring)

16

20.5

26

Trace / Space

½ oz base Cu

4/4

5/5

6/6

 

1 oz base Cu

5/5

7/6

8/8

 

2 oz base Cu

8/8

10/9

12/12

Inner layer copper to hole edge

10

12

15

Soldermask clearance

2.0

2.5

5

Thermal Ident line

6

6

6

LPI Ident line (opt process)

3

3

3

Scoring board edge to copper

20

25

25

Routing board edge to copper

0

5

10

Note:
  1. All boards manufactured to IPC Class 2 unless otherwise specified.
  2. Use "STANDARD" values or greater if design density permits to avoid cost penalties.
  3. Designs which do not meet minimum requirements must be reviewed by our manufacturing engineers.
DRILLING BOARD PROFILING
  • Blind buried via
  • Controlled depth drilling
  • Countersinking
  • Routing
  • V-Groove scoring
  • Milling
  • Beveling
SOLDER MASK / VIA PLUGGING
  • Liquid Photo-imagable (LPI)
  • Green, matte green, blue, black, Red, white, clear, other
  • Peelable Mask
  • Via plugging
  • Plated/Filled Via-in-Pad
IDENT / SILKSCREEN
  • White, yellow, black, red, other
  • LPI or Thermal
DATA FILE FORMAT

Gerber Data - RS274X (Extended Gerber – preferred); ODB++; RS274D
Drill Data – Excellon, ASCII

We are capable of converting or regenerating data (design dependant) from:

  • AutoCAD (DWG, DXF)
  • Acrobat (PDF)
  • Picture (JPG, TIFF, other)
  • Transparency Film artwork
  • and more
BOARD FINISHES
  • Hot Air Solder Level (HASL)
  • Immersion Gold on Electroless Ni
  • Electrolytic Gold (Hard Gold)
  • Gold Edge Fingers (board edge)
  • Selective Hard Gold (not on edge)
  • Immersion Silver
  • Carbon Paste
  • Immersion (White) Tin
  • Board Edge Plating
DESIGN VERIFICATION

Each design is routinely checked to identify many design issues such as:

  • Broken connections
  • Un-terminated traces
  • Missing solder mask clearances
  • Missing pads or holes on through hole pad-stacks
  • and more

…however, we cannot be held liable for failing to identify design issues.

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Enigma interconnect Certifications